1775375-1 datasheet

О ДАТАШИТЕ

Маркировка

1775375-1
Производитель

TE Connectivity
Описание

TE Connectivity 1775375-1 Boardlock Material: Brass Boardlock Plating: Tin over Nickel Connector Type: Receptacle Contact Base Material: Phosphor Bronze Contact Plating, Mating Area, Material: Gold (15) Gender: Receptacle Height Above Pc Board (mm [in]): 14.15 [0.557] High Temperature Housing: Yes Housing Color: Black Housing Material: Liquid Crystal Polymer (LCP) Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C Number Of Positions: 29 Number Of Rows: Dual Packaging Method: Tray Packaging Quantity: 60 Pcb Mount Retention: With Pcb Mount Retention Type: Boardlock(s) Pcb Mount Style: Through Hole Pcb Mounting Orientation: Vertical Product Type: Connector Receptacle Configuration: SAS Backplane, Hybrid Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Shell: Without Solder Tail Contact Plating: Matte Tin over Nickel Stackable: No Termination Post Length (mm [in]): 3.75 [0.147] Ul Flammability Rating: UL 94V-0
Количество страниц

2 шт.
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